技術(shù)規(guī)范標(biāo)準(zhǔn)-電路板pcba制造技術(shù)規(guī)范(docx 46頁(yè))

1、企業(yè)標(biāo)準(zhǔn)企業(yè)標(biāo)準(zhǔn)QB002–2014電路板（電路板（PCBA）制造技術(shù)規(guī)范）制造技術(shù)規(guī)范20130504發(fā)布發(fā)布20140510實(shí)施實(shí)施科技有限公司科技有限公司發(fā)布發(fā)布PCBA制造技術(shù)規(guī)范|二〇一四年五月十日||目錄|3目錄封面：電路板（PCBA）制造技術(shù)規(guī)范..........................................................................................

2、...............................................1修訂聲明........................................................................................................................................................................

3、........2目錄......................................................................................................................................................................................3前言........................

4、............................................................................................................................................................5術(shù)語(yǔ)解釋...........................................................

5、.....................................................................................................................6第一章PCBA制造生產(chǎn)必要前提條件.....................................................................................

6、.......................................71.1產(chǎn)品設(shè)計(jì)良好：...................................................................................................................................................71.2高質(zhì)量的材料及合適的設(shè)備：......

7、.....................................................................................................................71.3成熟穩(wěn)定的生產(chǎn)工藝：.........................................................................................

8、..............................................71.4技術(shù)熟練的生產(chǎn)人員：.......................................................................................................................................7附圖1SCC標(biāo)準(zhǔn)PCBA生產(chǎn)控制流程......

9、....................................................................................................................8附圖2SCC標(biāo)準(zhǔn)SMT工藝加工流程......................................................................................

10、.......................................9第二章車(chē)間溫濕度管控要求..........................................................................................................................................102.1車(chē)間內(nèi)溫度、相對(duì)濕度要求：............

11、.............................................................................................................102.2溫度濕度檢測(cè)儀器要求：...............................................................................................

12、..................................102.3車(chē)間內(nèi)環(huán)境控制的相關(guān)規(guī)定：.........................................................................................................................102.4溫濕度日常檢查要求：................................

13、.....................................................................................................10第三章濕度敏感組件管制條件........................................................................................................

14、..............................113.1IC類(lèi)半導(dǎo)體器件烘烤方式及要求：................................................................................................................113.2IC類(lèi)半導(dǎo)體器件管制條件：.......................................

15、.....................................................................................113.3PCB管制規(guī)范：..........................................................................................................................

16、......................11第四章表面組裝元器件(SMC／SMD)概述.................................................................................................................134.1表面組裝元器件基本要求：.............................................

17、................................................................................134.2表面組裝元器件（SMCSMD）的包裝類(lèi)型：...............................................................................................134.3表面組裝元器件使人用注意事項(xiàng)

18、：.................................................................................................................14第五章SMT工藝概述..............................................................................................

19、........................................................155.1SMT工藝分類(lèi)：................................................................................................................................................155.2施加

20、焊膏工藝：.................................................................................................................................................165.3施加貼片紅膠工藝：........................................................

21、.................................................................................165.4施加貼片紅膠的方法和各種方法的適用范圍：.............................................................................................185.5貼裝元器件：..........

22、...........................................................................................................................................185.6貼片回流焊（再流焊）：.................................................................

23、................................................................185.7回流焊特點(diǎn)：.................................................................................................................................................

24、....195.8回流焊的分類(lèi)：.................................................................................................................................................195.9回流焊的工藝要求：.............................................

25、............................................................................................19第六章表面組裝工藝材料介紹―焊膏..............................................................................................................